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Gigabyte B560M Aorus Pro Ax Intel B560 Express Chipset Motherboard, Micro ATX Form Factor, Lga1200, Advanced Thermal Design

$326.00
1 Year New Zealand Warranty
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$326.00
or 10 Payments of $42.99 with
or 10 payments of $42.99 with

Gigabyte B560M AORUS PRO AX motherboard supports 11th and 10th Gen. Intel® Core™ Series Processors. With Direct 12+1 Phases Digital VRM with DrMOS, Full PCIe 4.0* Design, Fully Covered Thermal Design with Integrated IO Armor, PCIe 4.0* M.2 with Thermal Guard, Intel® 2.5GbE LAN with cFosSpeed, Intel® WiFi 6 802.11ax , Rear USB 3.2 Gen2x2 TYPE-C®, RGB FUSION 2.0, Q-Flash Plus. Get yours from Parallel Imported today!

Features:

DIRECT POWER DESIGN
B560M AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.

ADVANCED THERMAL SOLUTION
B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.

2X larger Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design

Multi-cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Performance
With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.

Support for DDR4 XMP Up to 4800MHz and Beyond
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 4800MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

Intel® WiFi 6 802.11ax + BT 5 Module
Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

USB Type-C® Front Panel Connector
Equipped with next generation connectivity AORUS Motherboards already support the chassis of the future. The onboard USB Type-C® header for USB 3.2 Gen1 makes access convenient when connecting a USB 3.2 Gen1 drive or charging your new mobile device.

Description

Gigabyte B560M AORUS PRO AX motherboard supports 11th and 10th Gen. Intel® Core™ Series Processors. With Direct 12+1 Phases Digital VRM with DrMOS, Full PCIe 4.0* Design, Fully Covered Thermal Design with Integrated IO Armor, PCIe 4.0* M.2 with Thermal Guard, Intel® 2.5GbE LAN with cFosSpeed, Intel® WiFi 6 802.11ax , Rear USB 3.2 Gen2x2 TYPE-C®, RGB FUSION 2.0, Q-Flash Plus. Get yours from Parallel Imported today!

Features:

DIRECT POWER DESIGN
B560M AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.

ADVANCED THERMAL SOLUTION
B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.

2X larger Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design

Multi-cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Performance
With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.

Support for DDR4 XMP Up to 4800MHz and Beyond
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 4800MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

Intel® WiFi 6 802.11ax + BT 5 Module
Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

USB Type-C® Front Panel Connector
Equipped with next generation connectivity AORUS Motherboards already support the chassis of the future. The onboard USB Type-C® header for USB 3.2 Gen1 makes access convenient when connecting a USB 3.2 Gen1 drive or charging your new mobile device.

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