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Kingston 32GB 3200Mhz DDR4 Non-Ecc Cl22 Dimm

$305.00
1 Year New Zealand Warranty
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Kingston 32GB 3200mHz DDR4 Non-Ecc CL22 DIMM. KVR32N22D8/32 is a 4G x 64-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Get yours from Parallel Imported today!

Features:

  • Power Supply: VDD = 1.2V Typical; VDDQ = 1.2V Typical; VPP = 2.5V Typical; VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for  data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8  via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free 

Specifications:

  • CL(IDD): 22 cycles
  • Row Cycle Time (tRCmin): 45.75ns(min.)
  • Refresh to Active/Refresh Command Time (tRFCmin): 350ns(min.)
  • Row Active Time (tRASmin): 32ns(min.)
  • UL Rating: 94 V - 0
  • Operating Temperature: 0 to +85 degree celcius
  • Storage Temperature: -55 to +100 degree celcius
Description

Kingston 32GB 3200mHz DDR4 Non-Ecc CL22 DIMM. KVR32N22D8/32 is a 4G x 64-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 2Rx8, memory module, based on sixteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Get yours from Parallel Imported today!

Features:

  • Power Supply: VDD = 1.2V Typical; VDDQ = 1.2V Typical; VPP = 2.5V Typical; VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for  data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8  via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free 

Specifications:

  • CL(IDD): 22 cycles
  • Row Cycle Time (tRCmin): 45.75ns(min.)
  • Refresh to Active/Refresh Command Time (tRFCmin): 350ns(min.)
  • Row Active Time (tRASmin): 32ns(min.)
  • UL Rating: 94 V - 0
  • Operating Temperature: 0 to +85 degree celcius
  • Storage Temperature: -55 to +100 degree celcius
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